Durable Electronic Plastic Housing for Enclosures
Durable Electronic Plastic Housing for Enclosures
Durable Electronic Plastic Housing for Enclosures
Durable Electronic Plastic Housing for Enclosures
Durable Electronic Plastic Housing for Enclosures
Durable Electronic Plastic Housing for Enclosures
Durable Electronic Plastic Housing for Enclosures

Durable Electronic Plastic Housing for Enclosures

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Description
Injection Molding plastic panel frame
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Product Description
ZIBO HUIWEN injection factoryHUIWEN plastic partsFACTORY HUIWEN
Durable Electronic Plastic Housing for Enclosures
 
 
Plastic Enclosure electronic boxes are core components for protecting circuit boards, sensors, and electronic components, and injection molding is the mainstream manufacturing process for such products due to its high efficiency, precision, and suitability for mass production. 
 

Core Mold Design Requirements for Electronic Boxes

  • Dimensional Compensation for Shrinkage: According to material shrinkage rates (ABS: 0.5%–0.8%; PC: 0.6%–0.9%), reserve precise compensation in the mold to ensure the electronic box matches with internal components (e.g., PCB boards, connectors).
  • Waterproof & Sealing Structure Design:
    • Add groove for rubber gaskets (width 2–3mm, depth 1–1.5mm) on the box cover or base to achieve IP65/IP67 waterproof rating.
    • Design interlocking buckles instead of only screw fixing to enhance sealing and simplify assembly.
  • Draft Angle & Demolding Optimization: Set a draft angle of 1°–3° for inner and outer surfaces to avoid demolding scratches; for deep cavity electronic boxes, use core-pulling mechanisms to ensure smooth demolding of complex structures (e.g., threaded holes, protruding ribs).
  • Gating System Design: Use submarine gates or edge gates to avoid visible gate marks on the surface; for large electronic boxes, adopt multi-point gating to ensure uniform melt filling and reduce internal stress.
  • Cooling System Design: Arrange cooling water channels evenly around the mold cavity (distance from cavity surface 10–15mm) to ensure uniform cooling, prevent warpage and sink marks, and improve production efficiency (cycle time reduction by 10%–20%).
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Application Scenarios

  • Consumer Electronics: Router enclosures, power adapter shells, smart home control boxes.
  • Industrial Control: PLC enclosures, sensor junction boxes, industrial instrument housings.
  • Outdoor Electronics: Monitoring camera enclosures, solar controller boxes, communication base station signal boxes.
  • Automotive Electronics: Vehicle-mounted control unit enclosures, battery management system (BMS) boxes.
application1Custom Plastic Part Injection Molding Product 4PackingFAQ (2)
 
 
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